Intel BX80570E8200A Ficha Técnica descarregar pdf (Página 95)

Case Temperature Reference Metrology

Thermal and Mechanical Design Guidelines 95

12. Place a 3

piece of tape at the end of the step in the groove as shown in

Figure

7-22. This tape will create a solder dam to prevent solder from flowing into

the larger IHS groove section during the melting process.

13. Measure resistance from thermocouple end wires (hold both wires to a DMM

probe) to the IHS surface. This should be the same value as measured during the

thermocouple conditioning Section

D.5.1.step 3 (Figure 7-23).

Figure

7-23. Measuring Resistance between Thermocouple and IHS

14. Using a fine point device, place a small amount of flux on the thermocouple bead.

Be careful not to move the thermocouple bead during this step (Figure

7-24).

Ensure the flux remains in the bead area only.

1 2 ... 90 91 92 93 94 95 96 97 98 99 100 ... 127 128

Sem comentários

Intel BX80570E8200A Ficha Técnica Página 95