Intel 80526KZ800256 Ficha Técnica descarregar pdf (Página 86)

BOXED PROCESSOR SPECIFICATIONS

Figure 35. Front View Space Requirements for the Boxed Processor

9.2.1 BOXED PROCESSOR HEATSINK DIMENSIONS

Table 53. Boxed Processor Heatsink Dimensions

Fig. Ref.

Label

Dimensions (Inches) Min Typ Max

A Heatsink Depth (off heatsink attach point) 1.03

B Heatsink Height (above baseboard) 0.485

C Heatsink Base Thickness 0.200

D Heatsink Total Height at Fins 4.065

E Heatsink Total Height at Base (see front view) 4.235

F Heatsink Width (see front view) 5.05

9.2.2 BOXED PROCESSOR HEATSINK WEIGHT

The boxed processor heatsink will not weigh more than 350 grams (without auxiliary fan).

9.2.3 BOXED PROCESSOR RETENTION MECHANISM

The boxed Pentium® III Xeon™ processor at 700 MHz and 900 MHz requires a retention mechanism that

supports and secures the Single Edge Contact Cartridge (S.E.C.C.) in the 330-contact slot connector. An

S.E.C.C. retention mechanism is not provided with the boxed processor. Baseboards designed for use by

system integrators should include a retention mechanism and appropriate installation instructions. The boxed

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