Intel E8500 Manual do Utilizador descarregar pdf (Página 17)

Intel

E8500 Chipset North Bridge (NB) and eXternal Memory 17

Bridge (XMB) Thermal/Mechanical Design Guide

4 Thermal Simulation

Intel provides thermal simulation models of the E8500 chipset NB/XMB components and

associated user's guides to aid system designers in simulating, analyzing, and optimizing their

thermal solutions in an integrated, system-level environment. The models are for use with the

commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool

FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in

ICEPAK* format. Contact your Intel field sales representative to order the thermal models and

user's guides.

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Intel E8500 Manual do Utilizador Página 17