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PENTIUM® PROCESSOR WITH MMX™ TECHNOLOGY E

5/23/97 10:47 AM 24318502.DOC

INTEL CONFIDENTIAL

(until publication date)

Table 20. Thermal Resistance for SPGA Packages

Heatsink Height θ

(°C/Watt) vs. Laminar Airflow (linear ft/min)

(inches) (°C/Watt) 0 100 200 400 600 800

0.25 0.9 9.2 8.1 6.7 4.6 3.7 3.1

0.35 0.9 8.9 7.6 6.1 4.1 3.4 2.9

0.45 0.9 8.5 7.1 5.4 3.7 3.0 2.6

0.55 0.9 8.2 6.6 4.8 3.3 2.7 2.4

0.65 0.9 7.8 6.1 4.4 3.1 2.5 2.2

0.80 0.9 7.1 5.4 4.0 2.9 2.3 2.1

1.00 0.9 6.4 4.8 3.7 2.7 2.2 1.9

1.20 0.9 6.0 4.4 3.4 2.5 2.1 1.9

1.40 0.9 5.5 4.0 3.1 2.3 2.0 1.8

Without Heatsink 1.4 14.4 13.4 12.1 9.7 8.0 7.0

NOTES:

Heatsinks are omni directional pin aluminum alloy.

Features were based on standard extrusion practices for a given height:

Pin size ranged from 50 to 129 mils

Pin spacing ranged from 93 to 175 mils

Based thickness ranged from 79 to 200 mils

Heatsink attach was 0.005" of thermal grease.

Attach thickness of 0.002" will improve performance approximately 0.3ºC/Watt.

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Intel FV8050366233 Ficha Técnica Página 48