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Package Mechanical Specifications

38 Datasheet

3.5 Package Insertion Specifications

The processor can be inserted into and removed from a LGA775 socket 15 times. The

socket should meet the LGA775 requirements detailed in the LGA775 Socket

Mechanical Design Guide.

3.6 Processor Mass Specification

The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all

the components that are included in the package.

3.7 Processor Materials

Tab l e 2 1 lists some of the package components and associated materials.

3.8 Processor Markings

Figure 9 shows the topside markings on the processor. This diagrams can be used to

aid in the identification of the processor.

Table 21. Processor Materials

Component Material

Integrated Heat Spreader

(IHS)

Nickel Plated Copper

Substrate Fiber Reinforced Resin

Substrate Lands Gold Plated Copper

Figure 9. Intel

Celeron

Processor E3x00 Series Top-Side Markings Example

ATPO

S/N

Intel® Celeron®

SLGU4 [COO]

2.50GHZ/1M/800/06

[FPO]

1 2 ... 33 34 35 36 37 38 39 40 41 42 43 ... 99 100

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Intel AT80571RG0601ML Ficha Técnica Página 38