Intel LE80557RE009512 Ficha Técnica descarregar pdf (Página 34)

Package Mechanical Specifications and Pin Information

34 Datasheet

4.1.3 Processor Mass Specifications

The typical mass is given in Figure 4 and Table 16. This mass includes all the

components that are included in the package.

Table 16. Micro-FCBGA Package Mechanical Specifications

Symbol Parameter Min Max Unit Figure

B1 Package substrate width 34.95 35.05 mm Figure 4

B2 Package substrate length 34.95 35.05 mm Figure 4

C1 Die width 11.1 mm Figure 4

C2 Die length 8.2 mm Figure 4

F2 Die height (with underfill) 0.89 mm Figure 4

Package overall height (package

substrate to die)

2.022 Max mm Figure 4

Width (first ball center to lass ball

center)

31.75 Basic mm Figure 4

Length (first ball center to last ball

center)

31.75 Basic mm Figure 4

J1 Ball pitch (horizontal) 1.27 Basic mm Figure 4

J2 Ball pitch (vertical) 1.27 Basic mm Figure 4

M Solder Resist Opening 0.61 0.69 mm Figure 4

NBall height 0.6 0.8 mmFigure 4

—

Corener Keep-out zone at corner

(4X)

7 x 7 mm Figure 5

—

Keep-out from edge of package

(4x)

5mmFigure 5

— Package edge to first ball center 1.625 mm Figure 5

die

Allowable pressure on the die for

thermal solution

689 kPa

WPackage weight 6 g

1 2 ... 29 30 31 32 33 34 35 36 37 38 39 ... 65 66

Sem comentários

Intel LE80557RE009512 Ficha Técnica Página 34