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Package Mechanical Specifications

36 Datasheet

3.5 Package Insertion Specifications

The processor can be inserted into and removed from a LGA775 socket 15 times. The

socket should meet the LGA775 requirements detailed in the LGA775 Socket

Mechanical Design Guide.

3.6 Processor Mass Specification

The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all

the components that are included in the package.

3.7 Processor Materials

Table 20 lists some of the package components and associated materials.

3.8 Processor Markings

Figure 9 shows the topside markings on the processor. This diagram is to aid in the

identification of the processor.

Table 20. Processor Materials

Component Material

Integrated Heat Spreader

(IHS)

Nickel Plated Copper

Substrate Fiber Reinforced Resin

Substrate Lands Gold Plated Copper

Figure 9. Processor Top-Side Markings

ATPO

S/N

INTEL® CORE™2 EXTREME

SLxxx [COO]

2.93GHZ/8M/1066

[FPO]

1 2 ... 31 32 33 34 35 36 37 38 39 40 41 ... 87 88

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