Intel HH80552PG0882M Ficha Técnica descarregar pdf (Página 3)

Datasheet 3

Contents

1 Introduction....................................................................................................................................9

1.1 Terminology........................................................................................................................10

1.1.1 Processor Packaging Terminology........................................................................10

1.2 References .........................................................................................................................11

2 Electrical Specifications .............................................................................................................13

2.1 FSB and GTLREF...............................................................................................................13

2.2 Power and Ground Lands...................................................................................................13

2.3 Decoupling Guidelines........................................................................................................13

2.3.1 VCC Decoupling ....................................................................................................14

2.3.2 FSB GTL+ Decoupling...........................................................................................14

2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking...................................................14

2.4 Voltage Identification ..........................................................................................................15

2.4.1 Phase Lock Loop (PLL) Power and Filter..............................................................17

2.5 Reserved, Unused, FC and TESTHI Signals......................................................................18

2.6 FSB Signal Groups.............................................................................................................19

2.7 GTL+ Asynchronous Signals..............................................................................................20

2.8 Test Access Port (TAP) Connection...................................................................................21

2.9 FSB Frequency Select Signals (BSEL[2:0]) .......................................................................21

2.10 Absolute Maximum and Minimum Ratings .........................................................................22

2.11 Processor DC Specifications ..............................................................................................22

2.12 VCC Overshoot Specification .............................................................................................29

2.12.1 Die Voltage Validation ...........................................................................................30

2.13 GTL+ FSB Specifications....................................................................................................30

3 Package Mechanical Specifications ..........................................................................................33

3.1 Package Mechanical Specifications ...................................................................................33

3.1.1 Package Mechanical Drawing ...............................................................................33

3.1.2 Processor Component Keep-Out Zones................................................................37

3.1.3 Package Loading Specifications............................................................................37

3.1.4 Package Handling Guidelines................................................................................37

3.1.5 Package Insertion Specifications...........................................................................38

3.1.6 Processor Mass Specification................................................................................38

3.1.7 Processor Materials...............................................................................................38

3.1.8 Processor Markings...............................................................................................38

3.1.9 Processor Land Coordinates .................................................................................39

4 Land Listing and Signal Descriptions.......................................................................................41

4.1 Processor Land Assignments.............................................................................................41

4.2 Alphabetical Signals Reference..........................................................................................64

5 Thermal Specifications and Design Considerations................................................................73

5.1 Processor Thermal Specifications ......................................................................................73

5.1.1 Thermal Specifications ..........................................................................................73

5.1.2 Thermal Metrology.................................................................................................77

5.2 Processor Thermal Features ..............................................................................................77

5.2.1 Thermal Monitor.....................................................................................................77

1 2 3 4 5 6 7 8 ... 93 94

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