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6 Datasheet
7-10 Voltage Specifications.........................................................................................64
7-11 Current Specifications ........................................................................................65
7-12 VCC Overshoot Specifications..............................................................................66
7-13 DDR3 and DDR3L Signal DC Specifications............................................................67
7-14 PECI DC Specifications .......................................................................................68
7-15 System Reference Clock (BCLK{0/1}) DC Specifications..........................................68
7-16 SMBus DC Specifications.....................................................................................69
7-17 Joint Test Action Group (JTAG) and Test Access Point (TAP) Signals DC Specifications.69
7-18 Serial VID Interface (SVID) DC Specifications........................................................69
7-19 Processor Asynchronous Sideband DC Specifications...............................................70
7-20 Miscellaneous Signals DC Specifications................................................................70
8-1 Land List by Land Name .....................................................................................73
8-2 Land List by Land Number...................................................................................94
- LGA2011 Socket 1
- Table of Contents 3
- 4 Datasheet 4
- Datasheet 5 5
- 6 Datasheet 6
- Revision History 7
- 1 Introduction 8
- 1.1 Processor Feature Details 9
- 1.2 Supported Technologies 10
- 1.3 Interfaces 10
- 1.3.2 PCI Express* 11
- Transaction 12
- 1.4 Power Management Support 13
- 1.6 Package Summary 14
- 1.7 Terminology 14
- 1.8 Related Documents 16
- 2 Interfaces 18
- 2.2 PCI Express* Interface 19
- 2.2.1.1 Transaction Layer 20
- 2.2.1.2 Data Link Layer 20
- 2.2.1.3 Physical Layer 20
- Interface 21
- Interfaces 22
- 22 Datasheet 22
- 3 Technologies 23
- 3.1.2 Intel 24
- VT-x Features 24
- 3.1.3 Intel 24
- VT-d Objectives 24
- 3.1.3.1 Intel 25
- VT-d Features Supported 25
- 3.2 Security Technologies 26
- 3.3 Intel 26
- Technology) 26
- 3.4 Intel 27
- Turbo Boost Technology 27
- 3.5 Enhanced Intel 27
- SpeedStep 27
- Technology 27
- 3.6 Intel 28
- Datasheet 29 29
- Technologies 29
- 4 Power Management 30
- 4.2.1 Enhanced Intel 33
- 4.2.2 Low-Power Idle States 34
- 4.2.4.1 Core C0 State 36
- 4.2.4.2 Core C1/C1E State 36
- 4.2.4.3 Core C3 State 36
- 4.2.4.4 Core C6 State 36
- 4.2.4.5 Core C7 State 36
- 4.2.4.6 Delayed Deep C-States 37
- 4.2.5.1 Package C0 State 38
- 4.2.5.2 Package C1/C1E State 39
- 4.2.5.3 Package C2 State 39
- 4.2.5.4 Package C3 State 39
- 4.2.5.5 Package C6 State 40
- 4.3.2.1 Self-Refresh Entry 41
- 4.3.2.2 Self-Refresh Exit 42
- 4.3.2.3 DLL and PLL Shutdown 42
- 5 Thermal Management 43
- 6 Signal Descriptions 44
- Miscellaneous Signals 48
- 7 Electrical Specifications 52
- BCLK{0/1}_DN) 53
- 7.1.5.1 PLL Power Supply 54
- 7.1.8.2 Decoupling Guidelines 55
- Electrical Specifications 56
- 56 Datasheet 56
- 7.2 Signal Group Summary 59
- 7.5 DC Specifications 64
- 7.5.2.1 V 66
- Overshoot Specifications 66
- Unit Figure Notes 68
- Specifications 69
- Datasheet 71 71
- 8 Processor Land Listing 72
- (Sheet 1 of 42) 73
- (Sheet 2 of 42) 73
- (Sheet 3 of 42) 74
- (Sheet 4 of 42) 74
- (Sheet 5 of 42) 75
- (Sheet 6 of 42) 75
- (Sheet 7 of 42) 76
- (Sheet 8 of 42) 76
- (Sheet 9 of 42) 77
- (Sheet 10 of 42) 77
- (Sheet 11 of 42) 78
- (Sheet 12 of 42) 78
- (Sheet 13 of 42) 79
- (Sheet 14 of 42) 79
- (Sheet 15 of 42) 80
- (Sheet 16 of 42) 80
- (Sheet 17 of 42) 81
- (Sheet 18 of 42) 81
- (Sheet 19 of 42) 82
- (Sheet 20 of 42) 82
- (Sheet 21 of 42) 83
- (Sheet 22 of 42) 83
- (Sheet 23 of 42) 84
- (Sheet 24 of 42) 84
- (Sheet 25 of 42) 85
- (Sheet 26 of 42) 85
- (Sheet 27 of 42) 86
- (Sheet 28 of 42) 86
- (Sheet 29 of 42) 87
- (Sheet 30 of 42) 87
- (Sheet 31 of 42) 88
- (Sheet 32 of 42) 88
- (Sheet 33 of 42) 89
- (Sheet 34 of 42) 89
- (Sheet 35 of 42) 90
- (Sheet 36 of 42) 90
- (Sheet 37 of 42) 91
- (Sheet 38 of 42) 91
- (Sheet 39 of 42) 92
- (Sheet 40 of 42) 92
- (Sheet 41 of 42) 93
- (Sheet 42 of 42) 93
- Number (Sheet 1 of 42) 94
- Number (Sheet 2 of 42) 94
- Number (Sheet 3 of 42) 95
- Number (Sheet 4 of 42) 95
- Number (Sheet 5 of 42) 96
- Number (Sheet 6 of 42) 96
- Number (Sheet 7 of 42) 97
- Number (Sheet 8 of 42) 97
- Number (Sheet 9 of 42) 98
- Number (Sheet 10 of 98
- Number (Sheet 11 of 99
- Number (Sheet 12 of 99
- Table 8-2. Land List by Land 100
- Number (Sheet 13 of 100
- Number (Sheet 14 of 100
- Number (Sheet 15 of 101
- Number (Sheet 16 of 101
- Number (Sheet 18 of 102
- Number (Sheet 17 of 102
- Number (Sheet 19 of 103
- Number (Sheet 20 of 103
- Number (Sheet 21 of 104
- Number (Sheet 22 of 104
- Number (Sheet 23 of 105
- Number (Sheet 24 of 105
- Number (Sheet 25 of 106
- Number (Sheet 26 of 106
- Number (Sheet 27 of 107
- Number (Sheet 28 of 107
- Number (Sheet 29 of 108
- Number (Sheet 30 of 108
- Number (Sheet 31 of 109
- Number (Sheet 32 of 109
- Number (Sheet 33 of 110
- Number (Sheet 34 of 110
- Number (Sheet 35 of 111
- Number (Sheet 36 of 111
- Number (Sheet 37 of 112
- Number (Sheet 38 of 112
- Number (Sheet 39 of 113
- Number (Sheet 40 of 113
- Number (Sheet 41 of 114
- Number (Sheet 42 of 114
- 9 Package Mechanical 115
- 10.1 Introduction 116
- 10.2 Boxed Processor Contents 116
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