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Reference Thermal Solution

Intel

955X Express Chipset Thermal/Mechanical Design Guide 21

Figure 6-4. Retention Mechanism Component Keep-out Zones

4 x 8.76mm

4 x 5.08mm

4 x 1.84mm

8 x Ø0.97 mm P lated Thru Hole

8 x Ø1.42 mm Trace Keepout

No Components

this Area

4 x 8.76 m m

Max 1.27mm

Component

Height

RM_Component_KeepoutZones

6.5 Reference Heatsink Thermal Solution Assembly

The reference thermal solution for the MCH is a passive extruded heatsink with thermal interface.

It is attached using a clip with each end hooked through an anchor soldered to the board. Figure

6-5 shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in

Appendix B. Appendix A contains vendor information for each thermal solution component.

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Intel 955X Manual do Utilizador Página 21