Intel 8XC251SA Manual do Utilizador descarregar pdf (Página 33)

33 PRELIMINARY

8XC251SA/SB/SP/SQ HIGH-PERFORMANCE CHMOS MICROCONTROLLER

6.0 THERMAL CHARACTERISTICS

All thermal impedance data is approximate for static

air conditions at 1 watt of power dissipation. Values

change depending on operating conditions and

application requirements. The Intel

Packaging

Handbook

(order number 240800) describes Intel’s

thermal impedance test methodology.

Table 16. Thermal Characteristics

Package Type θ

44-pin PLCC 46°C/W 16°C/W

40-pin PDIP 45°C/W 16°C/W

40-pin Ceramic DIP 30.5°C/W 10°C/W

7.0 NONVOLATILE MEMORY PROGRAMMING AND VERIFICATION

CHARACTERISTICS

7.1 Definition of Nonvolatile Memory Symbols

Table 17. Nonvolatile Memory Timing Symbol Definitions

Signals Conditions

A Address H High

D Data In L Low

Q Data Out V Valid

S Supply X No Longer Valid

G PROG# Z Floating

E Enable

1 2 ... 28 29 30 31 32 33 34 35 36

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